ASM MS899-DL Wafer Mapping Die Sorter

Machine is in good condition!

Serial Number: MS899DL-01817-0402

Model Number: MS899-DL

Year 2008 August

Cycle Time: 175 ms

XY Placement: +/- 1.5 mil

Die Rotation: +/- 3 degrees

Collect type: Surface pick type

Pick/Bond Force: 40 - 250 g (adjustable)

Bin frame capability: Max 150

100 - buffer bin cassette

25 - empty bin cassette
25 - finished bin cassette

Bin Frame Size: 175 mm (I.D) / 195 (O.D)

Effective binning area: 58 x 58 mm2

Size of Mylar sheet: 195 x 195 mm2

Wafer loader capacity: Dscio Ring 25 / Foton Ring 12

Package Size Handling w/look ahead: 240 x 240 mil2

Package Size Handling w/o look ahead: 480 x 480 mil2

Power Requirements: 110 Volt - 50/60 HZ

Dimensions: 1448 mm x 1486 mm x 1626 mm

Weight: 100 kg

Location: Boston, MA

Price: $ 25,000